Archives
2025 4th International Symposium on Semiconductor and Electronic Technology (ISSET) on 25 – 27 July 2025 in Xi’an, China (Hybrid event). Read more
IRDS Industry Cooperation Update by Paolo Gargini (Chairman IRDS): Read more (PDF, 2 MB)
EU Chips Acts Update by Paolo Gargini, Chairman IRDS, Chairman TFRC: Read more (PDF, 3 MB)
ISEMV 2024 was a full-day in-person event held in October 2024 in Bellevue, the Greater Seattle Area, WA, USA. ISEMV 2024 consisted of invited speakers, panels, oral presentations of peer-reviewed papers, poster presentations, and a competition. Check out the competition site for more information.
IEEE-USA IWRC AI: University of Southern Maine (Portland Campus) | Portland, Maine on 15 May 2025. Read more at IEEE-USA IWRC AI
2025 IEEE Chips Summit: The first IEEE Chips Summit 2025 will be held on 14-15 May at Messe Dresden, Germany (in person event). Read more at IEEE
Semiconductor Job Skills Catalog project
As part of the Semiconductor Job Skills Catalog project, we are seeking individuals from companies across the semiconductor supply chain to be part of an industry advisory group for the project. These individuals should be versed in the workforce development needs of their organizations, particularly at the operator and technician levels, and willing to provide input on the roles, skills, and competencies identified through this project. We need the ad hoc’s help in identifying members of the industry advisory group. If you have names to recommend, please send their names, companies, job titles, and contact information to Jennifer Fong [email protected].
Design Automation Conference in San Francisco
Topic: Deep dive in foundry process design kits (PDKs)
23-27 June 2024
Read more (PDF, 9 MB)
TSMC and Intel Target Advanced Packaging to Seize Ecosystem Opportunities:
Read more at Semiconductor Packaging News
CHIPS for America Announces Two R&D Milestones
On Jan 31, 2024, CHIPS for America Announces Two R&D Milestones. CHIPS for America issued two Notices of Intent (NOI) – one for the National Advanced Packaging Manufacturing Program and the other for the CHIPS Manufacturing USA Institute.
IEEE Open Silicon Chips:
Supporting Outreach and Educational Activity. Read more (PDF, 738 KB)
Chips Act Update 9 April 2024:
Read more (PDF, 759 KB)
NIST Technology Strategy Fellowship:
NIST Technology Strategy Fellowship in Microelectronics Advanced Manufacturing (PDF, 138 KB)
CHIPS Office Releases Second Funding Opportunity Targeting Semiconductor Supply Chain
On 29 September the CHIPS Program Office (CPO) of the U.S. Department of Commerce (DOC) issued the second of two Notices of Funding Opportunity (NOFOs) targeted toward the semiconductor supply chain. This NOFO will support smaller projects, which CPO defines as being under $300 million in total capital costs. Eligible applicants include those intending to use CHIPS funding to support the construction, expansion, or modernization of semiconductor materials and manufacturing equipment production capacity.
International Roadmap for Devices and Systems (IRDS):
The 2023 update to the International Roadmap for Devices and Systems(IRDS) has been adopted by Europe, Japan and US as a reference document.
Chips for America
The Vision for the National Advanced Packaging Manufacturing Program. Read more (PDF, 5 MB)
Building the U.S.Semiconductor Workforce.
INVESTING IN AMERICA’S WORKERS. Read more (PDF, 6 MB)
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